Exploiting the combination of 3D polymer printing and inkjet Ag-nanoparticle printing for advanced packaging

- The combination of 3D polymer printing and Ag nanoparticle printing for rapid advanced packaging concept is proposed.
- The 3D polymer package housing with the Ag antenna structure is successfully connected with the SAW chip via flip-chip technique.
- The signal to noise ratio of about 30 dB via antenna-bridge radio frequency link confirms a stable and efficient SAW package prototype design.

A rapid advanced packaging concept, consisting of 3D photopolymer printing and Ag nanoparticle printing, was investigated for the construction of a simple radio frequency identification (RFID) package with integrated surface acoustic wave transponder (SAW). An acrylate-type SAW package housing was printed with a multi-jet 3D printer and the corresponding antenna for the wireless read-out was manufactured via inkjet printing of Ag nanoparticle ink. The corresponding Ag structure had a thickness of about 2 μm with a sheet resistance of 250 mΩ sq− 1 after the photonic sintering processing. The chip-on-board and flip-chip packaging concepts were pursued for connecting the antenna structure to the chip pads. The SAW package prototype in a flip-chip configuration showed a significant signal to noise ratio (SNR) of about 30 dB via antenna-bridged radio frequency link at a moderate distance of 3 cm.

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