کد مقاله کد نشریه سال انتشار مقاله انگلیسی ترجمه فارسی نسخه تمام متن
5024927 1369840 2018 8 صفحه PDF ندارد دانلود رایگان
عنوان انگلیسی مقاله
Full length articleStudy on the law of multiparameter in dipping process
کلمات کلیدی
Dipping process; Flip-chip; Multiparameter; Microelectronics packaging; Flux;
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی (عمومی)
پیش نمایش صفحه اول مقاله
Full length articleStudy on the law of multiparameter in dipping process
چکیده انگلیسی

In order to remove defect and enhance quality of flip-chip bonding, the influence of multiparameter in dipping process is researched. A dipping experimental bed is established, and images of dipping process is recorded by high-speed camera, the relationships between dipping glue quantity and dipping parameters including dipping speed, dipping depth, dipping time and viscosity of flux are discussed. In dipping process, a phenomenon that flux gathers into a mass was observed, and it is the main reason why there is a corrosion phenomenon. And dipping results show a decreasing trend of glue quantity as dipping speed increases, an increasing trend of glue quantity as dipping depth increases and an increasing trend of glue quantity as dipping time increases. The influence of viscosity is divided into two stages, it shows an increasing trend as viscosity increases when viscosity is smaller than 8 Pa S, and it is a decreasing trend as viscosity increases when viscosity is larger than 8 Pa S.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Optik - International Journal for Light and Electron Optics - Volume 152, January 2018, Pages 84-91
نویسندگان
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