کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
5143485 1496567 2017 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Conductometric and volumetric study of copper sulphate in aqueous ethanol solutions at different temperatures
موضوعات مرتبط
مهندسی و علوم پایه شیمی شیمی (عمومی)
پیش نمایش صفحه اول مقاله
Conductometric and volumetric study of copper sulphate in aqueous ethanol solutions at different temperatures
چکیده انگلیسی
An Anton Par Model 55 densimeter was used to measure the densities of copper sulphate solutions in H2O and EtOH-H2O at 298.15 K, 303.15 K, 308.15 K, and 313.15 K. The acquired information was used to ascertain the apparent molar volumes, limiting partial molar volumes, and transfer partial molar volumes of copper sulphate. These computed parameters were utilized to decipher the solute-solute and solute-solvent interactions of copper sulphate in an aqueous ethanol solution. The ion solvation behavior of copper sulphate in water and aqueous ethanol over the range of 298.15-313.15 K was studied using the electrical conductivity principle. The Kraus-Bray and Shedlovsky models of conductivity were used to analyze the obtained conductance data. From the obtained data, the limiting molar conductance λ°m, association constant KA, energy of activation of the rating process (Ea), and related thermodynamic parameters were determined. The Walden product (λ°mη0) was determined. The standard thermodynamic parameters of association (ΔG°A, ΔH°A) were calculated and discussed. Increased ion-solvent and solvent-solvent interactions are indicated by limiting molar conductance values with an increasing amount of ethanol. The negative ΔG°A values indicate that the association processes in all of the studied systems are spontaneous processes. The negative estimation of (ΔH°A) demonstrates that the association processes is exothermic in nature.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Taibah University for Science - Volume 11, Issue 5, September 2017, Pages 741-748
نویسندگان
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