کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
5480346 1399315 2017 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Comparative study of printed circuit board recycling by cracking of internal layers using organic solvents-dimethylformamide and dimethylacetamide
ترجمه فارسی عنوان
بررسی مقایسه ای از بازیافت تخته مدار چاپی با ترک خوردگی لایه های داخلی با استفاده از حلال های آلی-دی متیل فرمالید و دی متیل آمید
کلمات کلیدی
کاغذ چاپ مدار چاپی دی متیل استاتامید، دی متیل فرمالید، جداسازی، انحلال، ترک خوردن،
موضوعات مرتبط
مهندسی و علوم پایه مهندسی انرژی انرژی های تجدید پذیر، توسعه پایدار و محیط زیست
چکیده انگلیسی
Dissolution studies of the substrate resin of waste printed circuit boards (WPCBs) in two organic solvents have shown that dimethylacetamide (DMAc) is more effective than dimethylformamide (DMF). Variation of dissolution parameters elucidated that DMAc results in 20% more resin dissolution when the temperature is increasing from 120 °C to 140 °C. It also results in 217% higher dissolution efficiency when the WPCBs:DMAc (w/v) ratio is increased to 3:10 from 1:10. The DMAc showed higher dissolution of the resin than DMF, for WPCBs of different size under conditions viz.- 140 °C, and 3:10 (w/v) WPCB:solvent ratio. The WPCBs of 2.25 cm2 size were completely separated into glass fiber matrix and copper foils in 180 min. Dissolution of resin is associated with the hydrogen bonding interaction with parent DMAc molecule. Spent DMAc has been regenerated by rotary decompression evaporator and it's chemical structure and boiling point were found similar to pure DMAc. Dissolved solute in the DMAc has been recovered as the residue during regeneration. The residue and exhibits a thermal degradation profile and chemical structure similar to untreated brominated epoxy resin.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Cleaner Production - Volume 142, Part 4, 20 January 2017, Pages 1721-1727
نویسندگان
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