Bonding ZrB2-SiC-G ceramics using modified organic adhesive for engineering applications at ultra high temperatures in air

It is a challenge to bond ceramics for engineering applications at ultrahigh temperatures in air. In this paper, a high temperature organic adhesive (HTOA) was prepared using methylphenylsilicone resins (MPSR) as the matrix, trisilanolisobutyl-methylsilicone resin/polyhedral oligomeric silsesquioxane (POSS) as the modifier, ZrB2, SiO2 and Si powders as the inorganic fillers, and γ-aminopropyltriethoxysilane (KH550) as the curing agent. The synthesized HTOA was used to bond ZrB2-SiC-G ceramic (ZSG). The ceramic yield of MPSR was increased from 71% to 91% after being modified by trisilanolisobutyl-POSS. The average shear strength of ZSG joints bonded by HTOA was 13.2 MPa at room temperature. After 1500 °C/1 h processing, the bonding strength between HTOA and ZSG ceramic was 53.8 MPa. The inter-diffusion of elements between the HTOA and the ZSG occurred at 1500 °C and ZrSiO4 compound was formed via the interface reaction. The excellent high-temperature performance of the prepared HTOA makes it one of the convenient and effective organic adhesive for joining ZSG for engineering applications at ultrahigh temperatures in air.