The ultratough peeling of elastic tapes from viscoelastic substrates

• The peeling of an elastic tape from a viscoelastic substrate is investigated.
• Peeling is prevented when the external force is smaller than the Kendall's one.
• Steady-state peeling occurs for arbitrarily large forces when the tape is sufficiently stiff.
• Ultratough peeling is obtained by properly tuning the properties of tape and substrate.
• The duration of the peeling can be controlled when adhesion is required for a finite period of time.

The peeling of an elastic thin tape from a flat smooth viscoelastic substrate is investigated. Based on a Green function approach and on the translational invariance, a closed form analytical solution is proposed, which takes into account the viscoelastic dissipation in the substrate material.We find that peeling is prevented from taking place, only when the external force is smaller than the one predicted by Kendall's formula for elastic tapes on rigid substrates. However, we also find that, regardless of the value of the applied force, steady state detachment may occur when the elastic tape is sufficiently stiff. In this case, the constant peeling velocity can be modulated by properly defining the geometrical parameters and the material properties of tape and viscoelastic foundation. On the other hand, for relatively high peeling angles or compliant tapes a threshold value of the peeling force is found, above which the steady-state equilibrium is no longer possible and unstable detachment occurs.The present study contributes to shed light on the behavior of pressure sensitive adhesives in contact with viscoelastic substrates like the human skin. At the same time, it can be considered a first step towards a better understanding of the effect of viscoelastic dissipation on the fracture behavior of solids.

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