Keywords: خسارات زیرزمینی; Laser macro-structured; Grinding force; Grinding temperature; Subsurface damage;
مقالات ISI خسارات زیرزمینی (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: خسارات زیرزمینی; Molecular dynamics simulation; Subsurface damage; Traditional machining; Deformation mechanism; Laser assisted machining;
Keywords: خسارات زیرزمینی; Single-crystal silicon; Subsurface damage; Laser recovery; Recrystallization depth; Raman spectroscopy; Dopant concentration;
Keywords: خسارات زیرزمینی; Automatic detection; Optical glass; Image processing; Subsurface damage; Grinding;
Keywords: خسارات زیرزمینی; Plasma etching; Subsurface damage; Fused silica etching; LIDT; AR coatings; High power UV coatings;
Keywords: خسارات زیرزمینی; Rotary ultrasonic machining; Machining induced damages; Subsurface damage; Edge chipping; Brittle materials;
Keywords: خسارات زیرزمینی; Terahertz imaging; Carbon fiber-reinforced composites; Subsurface damage; Terahertz polarization; Deconvolution;
Keywords: خسارات زیرزمینی; Si thinning; Grinding; Wafer to wafer; 3D integration; Dielectric bonding; Subsurface damage;
Keywords: خسارات زیرزمینی; Silicon wafer; Chemo-mechanical grinding; Soft abrasive; Surface finish; Subsurface damage;
Keywords: خسارات زیرزمینی; Electrical discharge machining; EDM; Silicon carbide; SiC; Single crystal; Raman spectroscopy; Subsurface damage; Material decomposition; Phase transformation;
Keywords: خسارات زیرزمینی; Contact simulation; Elasto-plastic behaviour; Degradation; Frictional contact; Subsurface damage;
Keywords: خسارات زیرزمینی; Monocrystalline silicon; Grinding; Subsurface damage;
Keywords: خسارات زیرزمینی; Fixed abrasive; Diamond wire; Precision slicing; Single-crystal silicon; Dicing wire saw; Ductile mode machining; Subsurface damage; Surface integrity;
Keywords: خسارات زیرزمینی; Hydrothermal reaction; Subsurface damage; Soda lime silica glass; Water penetration; Hydrous species; Mechanical properties;
Keywords: خسارات زیرزمینی; Impact erosion; Abrasive jet machining; Subsurface damage; Discrete element;
Keywords: خسارات زیرزمینی; Wear; Diamond; Wire sawing; Silicon wafer; Surface; Subsurface damage;
Keywords: خسارات زیرزمینی; Silicon nitride; Rolling contact fatigue (RCF); Subsurface damage; Hybrid bearings; Snowflake structure;
Keywords: خسارات زیرزمینی; Diamond machining; Discrete element method; Subsurface damage; Glass; Fused silica; Laser optics;
Keywords: خسارات زیرزمینی; Impact erosion; Subsurface damage; Impact energy; Discrete element;
Keywords: خسارات زیرزمینی; Nanoscale; High speed grinding; MD simulation; Subsurface damage;
Keywords: خسارات زیرزمینی; Surface roughness; Subsurface damage; Grinding; Wheel vibration; Optical glass
Keywords: خسارات زیرزمینی; Precision grinding; Coarse-grained diamond wheel; Micro-structuring; Laser machining; Optical glass; Subsurface damage
Keywords: خسارات زیرزمینی; Oscillating ball bearings; High contact load; Numerical analysis; Subsurface damage
Keywords: خسارات زیرزمینی; Nanoscale; High speed grinding; Molecular dynamics; Subsurface damage; Deformation mechanism;
Keywords: خسارات زیرزمینی; Cutting; Finite element method (FEM); Modeling; Anisotropic machinability; Subsurface damage
Evaluation of subsurface damage inherent to polished GaN substrates using depth-resolved cathodoluminescence spectroscopy
Keywords: خسارات زیرزمینی; Subsurface damage; Chemical mechanical polishing; Non-radiative recombination; Cathodoluminescence spectroscopy; Gallium nitride;
A nano-imprint method analysis of the optical subsurface quality processed by hydrodynamic effect polishing
Keywords: خسارات زیرزمینی; Subsurface damage; Hydrodynamic effect polishing; Nano-imprint; Impressed depth; Residual stress;
On the improvement of subsurface quality of CaF2 single crystal machined by boron-doped nano-polycrystalline diamond tools
Keywords: خسارات زیرزمینی; Single-crystal CaF2; Cutting tool; Boron-doped diamond; Subsurface damage;
Robust and automatic measurement of grinding-induced subsurface damage in optical glass K9 based on digital image processing
Keywords: خسارات زیرزمینی; Measurement; Optical glass; Image processing; Subsurface damage; Grinding;
Study of initiation and development of local oxidation phenomena during anodizing of SiC
Keywords: خسارات زیرزمینی; Single crystal SiC; Anodic oxidation; Subsurface damage; Doping; Protrusion;
Influence of crystal anisotropy on subsurface damage in ultra-precision cylindrical turning of CaF2
Keywords: خسارات زیرزمینی; Ultra-precision cylindrical turning; Single-crystal CaF2; Crystal anisotropy; Subsurface damage; Optical microcavity;
Removal mechanism of sapphire substrates (0001, 112¯0 and 101¯0) in mechanical planarization machining
Keywords: خسارات زیرزمینی; Sapphire substrates; Subsurface damage; Material removal mechanism; Mechanical planarization machining;
A numerical study of ultraprecision machining of monocrystalline silicon with laser nano-structured diamond tools by atomistic simulation
Keywords: خسارات زیرزمینی; Molecular dynamics; Phase transformation; Laser nano-structured diamond tool; Subsurface damage; Ultraprecision machining;
Ultraprecision surface flattening of porous silicon by diamond turning
Keywords: خسارات زیرزمینی; Porous material; Single-crystal silicon; Diamond turning; Material removal mechanism; Subsurface damage; Surface quality;
The mechanics of milling of germanium for IR applications
Keywords: خسارات زیرزمینی; Ultra-precision milling; Optical materials; Subsurface damage;
Investigation on morphology and evolution process of plasma induced pitting damage during the ICP etching of fused silica
Keywords: خسارات زیرزمینی; Plasma induced pitting damage; ICP etching; Fused silica; Subsurface damage; Morphology; Evolution
Picosecond laser texturization of mc-silicon for photovoltaics: A comparison between 1064Â nm, 532Â nm and 355Â nm radiation wavelengths
Keywords: خسارات زیرزمینی; mc-Silicon; Solar cells; Laser texturing; Picosecond lasers; Subsurface damage;
A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers
Keywords: خسارات زیرزمینی; Grinding; Subsurface damage; Silicon; Residual stress; Load identification
Evaluation of grinding-induced subsurface damage in optical glass BK7
Keywords: خسارات زیرزمینی; Subsurface damage; Optical glass BK7; Grinding;
Photo-electrochemical etching of free-standing GaN wafer surfaces grown by hydride vapor phase epitaxy
Keywords: خسارات زیرزمینی; Gallium nitride; Photo-electrochemical etching; Free-standing wafer; Hydride vapor phase epitaxy (HVPE); Subsurface damage
Evaluation of subsurface damage in GaN substrate induced by mechanical polishing with diamond abrasives
Keywords: خسارات زیرزمینی; GaN substrate; Mechanical polishing; Chemical mechanical polishing; Subsurface damage; Cathodoluminescence; Brittle materials;
Subsurface crack determination by one-sided ultrasonic measurements
Keywords: خسارات زیرزمینی; Corrosion; Frequency; Nondestructive testing; Rayleigh waves; Subsurface damage
Atomistic simulation of the influence of nanomachining-induced deformation on subsequent nanoindentation
Keywords: خسارات زیرزمینی; Nanomachining; Nanoindentation; Molecular dynamics; Plasticity; Subsurface damage
Analytical model to determine the critical conditions for the modes of material removal in the milling process of brittle material
Keywords: خسارات زیرزمینی; Ductile-mode milling; Subsurface damage; Micro-milling; Crack-free machining
Evaluation of coated and uncoated CaF2 optics by variable angle spectroscopic ellipsometry
Keywords: خسارات زیرزمینی; CaF2; Subsurface damage; Color center; F-doped SiO2 film; ArF laser optics;
Subsurface quality of polished SiO2 surface evaluated by quasi-Brewster angle technique
Keywords: خسارات زیرزمینی; Subsurface damage; Quasi-Brewster angle technique; Ellipsometry parameters
Characterization of glass surface damaged by alumina abrasive grains
Keywords: خسارات زیرزمینی; Glass; Surface; Lapping; Subsurface damage;
Grinding of silicon wafers using an ultrafine diamond wheel of a hybrid bond material
Keywords: خسارات زیرزمینی; Silicon wafer; Surface finish; Subsurface damage; Grinding
Morphology and distribution of subsurface damage in optical fused silica parts: Bound-abrasive grinding
Keywords: خسارات زیرزمینی; Fused silica; Diamond grinding; Subsurface damage; Depth of cut; Wheel peripheral speed; Feeding rate;
A transmission electron microscopy study of crack formation and propagation in electrochemically cycled graphite electrode in lithium-ion cells
Keywords: خسارات زیرزمینی; Graphite; Lithium-ion; Subsurface damage; Cyclic voltammetry; Crack formation; Transmission electron microscope;