| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10145611 | Journal of Electroanalytical Chemistry | 2018 | 9 Pages |
Abstract
Tricyclazole (TCA), a nitrogen-containing heterocyclic compound, is employed as potential leveler for filling electroplated copper microvias. The TCA exhibits excellent filling performance due to the strong donor-acceptor interaction between TCA and the copper surface thanks to the formation of Cu(I)TCA complex or polymeric complexes.579
Keywords
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
Chaohui Liao, Shengtao Zhang, Shijin Chen, Yujie Qiang, Gen Liu, Mingxing Tang, Bochuan Tan, Denglin Fu, Yue Xu,