Analysis of shear stress promoting void evolution behavior in an α/β Ti alloy with fully lamellar microstructure

interface, or along shear bands within one grain/colony, or at grains/colonies boundary. This could be interpreted by the role of shear stress during this processing. Based on the location of voids, shear stress can be taken into consideration at α/β interface, shear band within one grain and grains/colonies boundaries, respectively. The origins of shear stress at different scales seems correlated to local microstructure inhomogeneity and subsequent heterogeneous plastic deformation at different scales. Void nucleation and propagation could depend on this local shear stress instead of stress triaxiality.