| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10156052 | Materials Letters | 2019 | 4 Pages |
Abstract
The wetting phenomenon of Sn-37Pb alloy solder spreading on Cu substrate under different ultrasonic fields was investigated. Sn-37Pb/Cu wetting systems showed significant precursor film characteristics with the assist of ultrasonic energy. A short-time ultrasonic field evidently enhanced the wettability of Sn-37Pb/Cu compare to a common wetting field which had no introduced ultrasonic. At the temperature of 213â¯Â°C, spreading area of a Sn-37Pb solder drop in a 20â¯kHz, 1000â¯W ultrasonic field reached maximum at 2â¯s, and showed significant precursor film characteristics. Atomistic dynamic models showed the relevance between wettability and precursor film formation. The observed dynamic results agreed with the experimental results.
Related Topics
Physical Sciences and Engineering
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Nanotechnology
Authors
Yao Yang, Shaorong Li, Yuxin Liang, Bangsheng Li,