| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10248770 | Solar Energy Materials and Solar Cells | 2014 | 9 Pages |
Abstract
In this paper a short review is given about the evolution of dielectric rear side passivation technologies as well as on state-of-the-art cell and module results. Simple and cost effective cell and module designs utilizing standard as well as innovative manufacturing technologies are presented. Furthermore, it is shown that for all major steps multiple process options are available to further reduce the manufacturing costs. Using an optimized emitter and screen-printed metallization on commercially available 156Â mmÃ156Â mm p-type Czochralski-grown crystalline silicon wafers best cell efficiencies of 19.9% without dielectric rear surface passivation and 21.0% with dielectric rear surface passivation are demonstrated. Replacing the screen-printed front contacts by electroplated nickel-copper contacts record efficiencies of up to 21.3% are reached. By optimizing the module design and materials to reduce the resistive and optical losses, a peak module power of up to 306Â W and 19.5% aperture area efficiency are achieved.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Catalysis
Authors
Axel Metz, Dennis Adler, Stefan Bagus, Henry Blanke, Michael Bothar, Eva Brouwer, Stefan Dauwe, Katharina Dressler, Raimund Droessler, Tobias Droste, Markus Fiedler, Yvonne Gassenbauer, Thorsten Grahl, Norman Hermert, Wojtek Kuzminski, Agata Lachowicz,
