| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10268806 | Electrochimica Acta | 2011 | 7 Pages |
Abstract
⺠We study conventional (CH) vs. induction (IH) heating effect on Cu deposition on Ni. ⺠CH leads to a low coverage with weakly adherent copper microparticles. ⺠CH leads to a very large size distribution and uncontrolled morphology. ⺠IH leads to a high coverage of the surface with copper nanoparticles. ⺠IH leads to a sharp unimodal size repartition, controlled morphology and Cu2O shell.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
Sébastien Devillers, Quentin Lemineur, Joseph Delhalle, Zineb Mekhalif,