| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10269402 | Electrochimica Acta | 2005 | 6 Pages |
Abstract
A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
Norihiro Togasaki, Yutaka Okinaka, Takayuki Homma, Tetsuya Osaka,