Experimental study of transient natural convection heat transfer from simulated electronic chips

Experiments are performed using water to study the single-phase transient natural convection heat transfer from in-line four simulated electronic chips, which are flush-mounted to one wall of a vertical rectangular channel. The heat flux ranges from 1 kW/m2 to 6 kW/m2. The effect of heat fluxes, geometric parameters such as chip configuration numbers are investigated. The results indicate that the heat transfer coefficient is affected strongly by the number of chips. Results compare favourably with those obtained from the literature for steady-state forced and natural convection heat transfer. Correlations are presented for individual chips as well as for overall data in the transient regime. The transient correlation for overall data recommended is Nuℓ=1.06(Fo)-0.47(Raℓ)1/4.