Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10406729 | Journal of Electrostatics | 2013 | 7 Pages |
Abstract
In this paper, silicon based planar technology and high performance fluorocarbon polymer polytetrafluoroethylene (PTFE) are combined to achieve PTFE thin film electrets on wafer. The PTFE film is fabricated onto SiO2 substrates and Pt substrates using spin coating and annealing processes, and its electret effect is demonstrated using negative corona charging method. PTFE electrets with different surface morphology exhibit different charge storage capability. Maximally, surface potential of â396Â V is achieved on Pt substrates and â361Â V is achieved on SiO2 substrates. The average retain rate of surface potential over 240Â h is 90.6% for Pt substrates and 76.3% for SiO2 substrates. The proposed method presents the primary step toward integrated electrostatic devices.
Related Topics
Physical Sciences and Engineering
Engineering
Electrical and Electronic Engineering
Authors
Ling Bu, Xiaoming Wu, Xiaohong Wang, Litian Liu,