Linear μ-bending method for the measurement of the residual stress of surface-micromachined MEMS

The results from the tests about the surface-micromachined poly-silicon structures with various residual stresses demonstrate that the linear μ-bending method is reliable. The output from the linear μ-bending method is that the residual stress of as-deposited poly-silicon film is 142.7 MPa (compressive) with the standard deviation of 3.5% and that the residual stress of the poly-silicon film decreases as the annealing effect grows.