Article ID Journal Published Year Pages File Type
10411186 Solid-State Electronics 2005 4 Pages PDF
Abstract
An analytical model for the carrier density at the accumulation layer of TIGBT (Trench Insulated Gate Transistor) is presented in terms of the aspect ratio with the influence of the depth of the trench gate below the P base taken into account. Based on the model, analytic expressions for the potential drop on the drift region are derived using a linear dependence of the carrier density on the aspect ratio. The analytical results for the forward voltage drop show a good agreement with the numerical simulations using MEDICI.
Related Topics
Physical Sciences and Engineering Engineering Electrical and Electronic Engineering
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