Article ID Journal Published Year Pages File Type
10411622 Solid-State Electronics 2011 4 Pages PDF
Abstract
► InGaP/GaAs collector-up HBTs with a heat-dissipation packaging configuration is developed. ► The thermal handling in the device has been optimized through the variation of finger pitches. ► Structure thickness was reduced more than 35%, and the thermal resistance was improved over 40%.
Keywords
Related Topics
Physical Sciences and Engineering Engineering Electrical and Electronic Engineering
Preview
A highly-compact packaging design for improving the thermal performance of multi-finger InGaP/GaAs collector-up HBTs
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