Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10411704 | Solid-State Electronics | 2005 | 5 Pages |
Abstract
An investigation of the structures and design parameters of 4H-SiC trench inversion-channel MOSFETs using a two-dimensional (2D) numerical device simulation is presented. Material parameters have been adjusted appropriately for the 4H-SiC polytype and a systematic characterisation and optimization of a specific trench MOSFET with a 1.2 kV blocking voltage capability has been performed. Simulations have concentrated on optimizing the p-type doping concentration at the trench bottom, to keep the breakdown electric field in the oxide under its critical value. The trench depth was also examined and optimized to give a better on-state performance. For the MOSFET structure examined, a minimized on-state resistance of 53 mΩ cm2 was obtained.
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Authors
L. Chen, O.J. Guy, M.R. Jennings, P. Igic, S.P. Wilks, P.A. Mawby,