Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10411915 | Solid-State Electronics | 2005 | 8 Pages |
Abstract
As capacitor-less DRAM cell appears to be an interesting candidate for future embedded memory generations, we paid particular attention to overall performance and scalability of the 1T-Bulk concept. We have analysed this architecture through our analytical model. Then we have fabricated devices and we have measured the influence of different technological parameters: floating body doping level, gate length and gate oxide thickness. The 1T-Bulk cell is demonstrated to be a promising candidate for eDRAM applications up to the 45Â nm technological node.
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Physical Sciences and Engineering
Engineering
Electrical and Electronic Engineering
Authors
R. Ranica, A. Villaret, P. Malinge, P. Candelier, P. Masson, R. Bouchakour, P. Mazoyer, T. Skotnicki,