| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10416737 | Journal of Materials Processing Technology | 2012 | 9 Pages |
Abstract
⺠Thermal modelling of heating system in wafer based glass moulding was carried out. ⺠Radition from the interior of the glass palys an important role for thick wafers. ⺠The glass-mould contact heat transfer coefficient was determined. ⺠Temperature distribution in the glass wafer was calculated by three dimensional FE model. ⺠The criterion of temperature uniformity in the wafer for start of the moulding was evaluated.
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Authors
Ali Sarhadi, Jesper Henri Hattel, Hans Nørgaard Hansen, Cem Celal Tutum, Lasse Lorenzen, Peter M.W. Skovgaard,