SMT solder joint's semi-experimental fatigue model

The low-cycle fatigue induced by thermal cycling is the major concern in the reliability of surface mounted technology (SMT) for electronic packaging; however, dynamic loading effects to solder joint fatigue life have not been thoroughly investigated. In fact, the high-cycling fatigue induced by vibration can also contribute a significant effect. In certain circumstances it can become the dominant failure case when semiconductor devices are used in a vibration environment. In this paper, according to random vibration theory, a random fatigue semi-experimental model of SMT solder joint in random vibration condition is created and a series of vibration fatigue experimental vehicles including PBGA256 assembly were conducted. Compared with random vibration test results, its results are good enough to predict solder joints' fatigue.