Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10419178 | Mechanics Research Communications | 2005 | 8 Pages |
Abstract
The low-cycle fatigue induced by thermal cycling is the major concern in the reliability of surface mounted technology (SMT) for electronic packaging; however, dynamic loading effects to solder joint fatigue life have not been thoroughly investigated. In fact, the high-cycling fatigue induced by vibration can also contribute a significant effect. In certain circumstances it can become the dominant failure case when semiconductor devices are used in a vibration environment. In this paper, according to random vibration theory, a random fatigue semi-experimental model of SMT solder joint in random vibration condition is created and a series of vibration fatigue experimental vehicles including PBGA256 assembly were conducted. Compared with random vibration test results, its results are good enough to predict solder joints' fatigue.
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Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
Qiang Guo, Mei Zhao, HongFang Wang,