| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10420599 | Precision Engineering | 2013 | 8 Pages |
Abstract
⺠We propose a material removal rate (MRR) distribution model for SiO2 CMP. ⺠Contact mechanics are used for modeling the average MRR of SiO2 film. ⺠A spatial parameter for MRR distribution is obtained from semi-empirical study. ⺠The MRR distribution model consists of the average MRR and spatial parameter. ⺠The proposed model includes the newly proposed line density of particles.
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Authors
H.S. Lee, H.D. Jeong, D.A. Dornfeld,