| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10628265 | Composites Part A: Applied Science and Manufacturing | 2005 | 8 Pages |
Abstract
The mechanism of this phenomenon has been discussed in detail and related to the distribution of unoccupied volume in the dry resin and the location of water molecules at hydrogen bonding sites. The redistribution of the water molecules throughout the sites during thermal cycling is considered responsible for the enhancement and the reduction in moisture contents at high thermal spike temperatures.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Sunil K. Karad, David Attwood, Frank R. Jones,