| Article ID | Journal | Published Year | Pages | File Type | 
|---|---|---|---|---|
| 10628762 | Corrosion Science | 2005 | 8 Pages | 
Abstract
												During anodising of Al-Cu alloys, copper species are incorporated into the anodic alumina film, where they migrate outward faster than Al3+ ions. In the present study of an Al-1at.% Cu alloy, the valence state of the incorporated copper species was investigated by X-ray photoelectron spectroscopy, revealing the presence of Cu2+ ions within the amorphous alumina film. However, extended X-ray irradiation led to reduction of units of CuO to Cu2O, probably due mainly to interactions with electrons from the X-ray window of the instrument and photoelectrons from the specimen. The XPS analysis employed films formed on thin sputtering-deposited alloy/electropolished aluminium specimens. Such an approach enables sufficient concentrations of copper species to be developed in the anodic film for their ready detection.
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											Authors
												X. Zhou, G.E. Thompson, P. Skeldon, K. Shimizu, H. Habazaki, G.C. Wood, 
											