Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10634030 | Scripta Materialia | 2013 | 4 Pages |
Abstract
Solid-solution copper alloys are standard and widely used conductive materials. However, it is generally considered difficult to significantly improve the balance between the strength and electrical conductivity of these alloys. Here, we designed copper alloys that exhibit high strength and conductivity by using solid-solution hardening enhanced by supersaturation with Mg. Cu-Mg alloy has a conductivity at least three times higher than that of the representative solid-solution Cu-Sn, while retaining comparable strength. Cu-Al-Mg alloy showed greater strength and conductivity than Cu-Sn.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Kazunari Maki, Yuki Ito, Hirotaka Matsunaga, Hiroyuki Mori,