Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10634079 | Scripta Materialia | 2010 | 4 Pages |
Abstract
The thermal conductivities of carbon nanotube (CNT)-copper (Cu) composites are greatly increased for compositions containing up to 1 vol.% CNT and remain above the value for pure Cu up to 3 vol.% CNT. The obtained enhancement was in good agreement with estimates based on Eshelby's equivalent inclusion method. This agreement suggests that very low thermal resistance might be realized at the interface between CNTs and the Cu matrix, which consists of faceted and closely attached interface without any compounds.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Seungchan Cho, Keiko Kikuchi, Takamichi Miyazaki, Kenta Takagi, Akira Kawasaki, Takayuki Tsukada,