| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10634191 | Scripta Materialia | 2005 | 4 Pages |
Abstract
The strain rate sensitivity of the flow stress of ultrafine-grained Cu processed by ECAE is compared with that of vapor-deposited and electrodeposited Cu. The results for all three processing methods were in accord with the model of grain boundary shear promoted by the pile-up of dislocations.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
H. Conrad, K. Jung,