On the non-occurrence of tin pest in tin-silver-indium solders

Indium-containing lead-free solder alloys of the type Sn-3.2%Ag-10%In and Sn-2.8%Ag-20%In (in wt%) were aged at +4, −5, and −18 °C for periods of up to 20 months. They were investigated by light optical microscopy and X-ray diffraction for the occurrence of tin pest (brittle semiconducting α-Sn). No tin pest was detected in any of the samples.