| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10634412 | Scripta Materialia | 2005 | 6 Pages |
Abstract
An electro-deposited Cu sample with a high density of nano-scale growth twins shows an ultrahigh tensile strength (â¼1Â GPa) with a considerable plastic strain (>13%). Both the strength and the ductility increase with a decreasing twin lamellae thickness. The yield strength values follow the empirical Hall-Petch relationship for conventional polycrystalline Cu.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Y.F. Shen, L. Lu, Q.H. Lu, Z.H. Jin, K. Lu,