| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10634419 | Scripta Materialia | 2005 | 5 Pages |
Abstract
Tin-based solder joints are often near single or multi-crystalline and not polycrystalline, determined by comparing orientations measured using OIM on opposite sides of two solder joints. Comparison with 17 other joints indicated no preferred solidification orientation, though the likelihood for the tin c-axis to be in the plane of the joint is low.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
A.U. Telang, T.R. Bieler,