| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10634422 | Scripta Materialia | 2005 | 5 Pages |
Abstract
Carbon nanofiber/Cu composite powder has been fabricated by electroless plating. The copper plates were deposited on the carbon nanofiber uniformly and densely. The copper particles were aggregated during the thermal exposure in vacuum and hydrogen in order to reduce surface energy. Thermal exposure of the composite in air leads to the spheroidization of the powder.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
I.S. Kim, S.K. Lee,