| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10635151 | Scripta Materialia | 2005 | 6 Pages |
Abstract
The Sn-8.5Zn-0.5Ag-0.1Al-xGa solders were investigated. The results showed that the microstructure of the solders were eutectic. The addition of Ga dramatically decreased the melting point of solders. Notably, the increase in Ga content of the solder improved the solderability, the tensile strength and reduced the ductility.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Nai-Shuo Liu, Kwang-Lung Lin,