| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10635325 | Scripta Materialia | 2005 | 4 Pages |
Abstract
A dense population of voids was found along the interface between Cu3Sn and Cu following prolonged aging. The voids appeared only on the Cu3Sn/Cu interface that had been covered by roughly monolayer of Bi segregant. Void formation was related to vacancy condensation after the segregant took up vacancy sinks.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
P.L. Liu, J.K. Shang,