| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10635342 | Scripta Materialia | 2005 | 4 Pages |
Abstract
With small amount of Zn addition, a refined microstructure of bulk Sn-0.7Cu solder alloy has been obtained. Meanwhile, retardation effect has been observed on the growth of IMC layer at the solder/Cu joint interface. The composition variation of the interface IMC layer with the amount of Zn addition is reported and thermodynamically analyzed.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Fengjiang Wang, Xin Ma, Yiyu Qian,