| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10635497 | Scripta Materialia | 2005 | 5 Pages |
Abstract
Cu-12wt.%Ag filamentary microcomposite was prepared by heavy cold drawing. The microstructure was observed and the electrical resistivity determined at different strain levels. The mechanism responsible for the electronic conduction was discussed according to the microstructure evolution during drawing deformation.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
L. Zhang, L. Meng,