| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10635512 | Scripta Materialia | 2005 | 5 Pages |
Abstract
Sessile-drop wetting experiments and interfacial microstructure examinations show that at high temperature, Cu alloyed with Al mildly promotes the wettability, yet fails to enhance the adhesion and impede the thermal diffusion between Cu and SiO2, in contrast to the behavior observed in low-temperature annealing studies.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Ping Shen, Hidetoshi Fujii, Kiyoshi Nogi,