Article ID Journal Published Year Pages File Type
10639864 Materials Science and Engineering: B 2013 5 Pages PDF
Abstract
Damage formation mechanism of Nd:YVO4 implanted with MeV ions is investigated. MeV Si+ ions were implanted into Nd:YVO4 crystal, and the lattice damage was measured using Rutherford backscattering spectroscopy/channeling (RBS/C) method. The damage creation kinetic indicates a significant contribution from electronic energy loss to the surface damage. A detailed analysis allows us to deduce the different contributions from electronic and nuclear stopping powers to the lattice damage production. An obvious difference in extent of damage from 1 MeV and 3 MeV Si+ implantations also implies that there exists a threshold value of the electronic energy deposition for damage formation. The exact value of threshold is obtained by comparison with the experimental data obtained from 3 MeV O+, F+ and Si+ implantation results, which turns out to be (1.7 ± 0.1) keV/nm.
Related Topics
Physical Sciences and Engineering Materials Science Electronic, Optical and Magnetic Materials
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