Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10639864 | Materials Science and Engineering: B | 2013 | 5 Pages |
Abstract
Damage formation mechanism of Nd:YVO4 implanted with MeV ions is investigated. MeV Si+ ions were implanted into Nd:YVO4 crystal, and the lattice damage was measured using Rutherford backscattering spectroscopy/channeling (RBS/C) method. The damage creation kinetic indicates a significant contribution from electronic energy loss to the surface damage. A detailed analysis allows us to deduce the different contributions from electronic and nuclear stopping powers to the lattice damage production. An obvious difference in extent of damage from 1 MeV and 3 MeV Si+ implantations also implies that there exists a threshold value of the electronic energy deposition for damage formation. The exact value of threshold is obtained by comparison with the experimental data obtained from 3 MeV O+, F+ and Si+ implantation results, which turns out to be (1.7 ± 0.1) keV/nm.
Related Topics
Physical Sciences and Engineering
Materials Science
Electronic, Optical and Magnetic Materials
Authors
Yu-Jie Ma, Fei Lu, Jiao-Jian Yin, Chang-Dong Ma,