Article ID Journal Published Year Pages File Type
10640080 Materials Science and Engineering: B 2005 6 Pages PDF
Abstract
Barrier films for packaging applications are deposited by plasma enhanced chemical vapor deposition (PECVD) on PET film using a new, high density plasma source. The new source, termed the Penning Discharge Plasma source, implements a novel magnetic field/electrode configuration that confines the electron Hall current in an endless loop adjacent to the substrate. By confining the Hall current, a dense, uniform plasma is created and sustained over wide substrates. The result is high rate deposition at low substrate temperatures. The water vapor permeation of SiO2 barrier films is reported as well as deposition rate, coating thickness and other film properties.
Related Topics
Physical Sciences and Engineering Materials Science Electronic, Optical and Magnetic Materials
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