| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10646108 | Materials Science and Engineering: A | 2011 | 8 Pages |
Abstract
ⶠA model to describe void evolution in nanocrystalline metal film is proposed. ⶠThe surface energy, stress and grain size dependences of void growth are discussed. ⶠThe stress relaxation during the void evolution is investigated. ⶠThe effective stress relaxation distance is calculated.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Lingling Hu, Jianqiu Zhou,