| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10646135 | Materials Science and Engineering: A | 2011 | 8 Pages |
Abstract
ⶠWe add small amount of Ag and Cu into the Sn-5Sb solder alloy. ⶠWe examine changes in the microstructure and creep properties of the solder alloys. ⶠThe Sn-5Sb-0.7Cu solder alloy shows the highest creep resistance compared with the other two alloys. ⶠThe presence of hard Cu6Sn5 and fine SbSn IMCs in the Sn-5Sb-0.7Cu alloy increased the resistance to dislocation movement, and improved the creep properties.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
A.A. El-Daly, A.Z. Mohamad, A. Fawzy, A.M. El-Taher,