| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10646136 | Materials Science and Engineering: A | 2011 | 8 Pages |
Abstract
ⶠThis study examines creep behavior of four high Pb-based solders with alloying elements. ⶠDislocation creep limited by dislocation climb or viscous solute drag occurs in high Pb solders. ⶠViscous solute drag is the rate-limiting step for creep of 90Pb-10Sn due to high concentration of Sn. ⶠThe climb mechanism is switched from pipe diffusion to lattice diffusion at â¼0.7Tm. ⶠActivation energy for dislocation creep is reduced by In and Sn substitutional elements.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Harry Schoeller, Shubhra Bansal, Aaron Knobloch, David Shaddock, Junghyun Cho,