| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10646197 | Materials Science and Engineering: A | 2011 | 5 Pages |
Abstract
ⶠStress relaxation rate was increased after electromigration. ⶠDominant mechanism of the stress relaxation was changed after electromigration. ⶠGrain boundary grooves appeared on the surface after electromigration. ⶠIncrease of vacancy concentration at grain boundary accelerated stress relaxation.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
H.Y. Liu, Q.S. Zhu, Z.G. Wang, J.K. Shang,