| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10646264 | Materials Science and Engineering: A | 2011 | 8 Pages |
Abstract
ⶠCreep deformation mechanisms of the Sn-58Bi/Cu solder joints are investigated. ⶠIn situ observation by SEM is employed for experiments. ⶠThe strain of the solder joints increase exponentially with increasing cycles. ⶠGrain-boundary sliding is the major creep deformation mechanism of SnBi solder.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Q.K. Zhang, Z.F. Zhang,