| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10646267 | Materials Science and Engineering: A | 2011 | 7 Pages |
Abstract
ⶠA miniature single solder ball joint was designed to mimic the actual solder joints. ⶠThe strain rates determined using the miniature single solder joints are consistent with those from shear creep and dynamic compression tests. ⶠThe unloading shear fracture toughness is generally consistent with the amount of bulk solder fracture on the fractured surface.
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Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Se-Min Joo, Ho-Kyung Kim,