| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10646297 | Materials Science and Engineering: A | 2011 | 8 Pages |
Abstract
ⶠA novel adhesive was made using silicon-epoxy IPNs, B4C, etc. ⶠSatisfactory bonding strength 9.44 MPa was achieved at high temperature. ⶠThe adhesive had good heat-resistance property with 10% weight loss at 435 °C. ⶠFailure mode of joint was mixing failure due to the high chemical bonding force.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Jiangsong Zhang, Ruiying Luo, Min Jiang, Qiao Xiang, Jinsong Li,