| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10655514 | Intermetallics | 2011 | 9 Pages |
Abstract
⺠Alumina is encapsulated within the intermetallic compounds in Au-Al bonds. ⺠Alumina migrates towards the Au ball during annealing. ⺠Au4Al and AuAl2 layers form during bonding. ⺠Au8Al3 appears as a third phase. ⺠Au4Al is the terminal product after Al is completely consumed.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
H. Xu, C. Liu, V.V. Silberschmidt, S.S. Pramana, T.J. White, Z. Chen, V.L. Acoff,