Article ID Journal Published Year Pages File Type
10656610 Journal of Alloys and Compounds 2011 4 Pages PDF
Abstract
▶ Discontinuous polygonal-shape (Cu,Ni)6Sn5 IMCs formed at the Sn-3.0Ag-0.5Cu solder/ENEPIG interface during initial reflowing. ▶ Preferential consumption of Cu atoms within the solder. ▶ Continuous Ni diffusion from the Ni(P) layer. ▶ Sequentially variation of the interfacial IMCs: discontinuous (Cu,Ni)6Sn5-(Cu,Ni)6Sn5 and (Ni,Cu)3Sn4-embedded (Cu,Ni)6Sn5 in (Ni,Cu)3Sn4.
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Physical Sciences and Engineering Materials Science Metals and Alloys
Preview
Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn-Ag-Cu solder and ENEPIG substrate during a reflow process
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