Edge effect during nanoindentation of thin copper films

We used nanoindenting atomic force microscopy (AFM) for studying mechanical properties of the polycrystalline copper film deposited on Si substrates and patterned into 4-8 μm wide lines. The dependence of mechanical properties of the line on a distance from the line edge was studied. It was shown that the indentation compliance of the line increases with decreasing distance between the indent center and the edge of the strip. An unusual plastic deformation behavior of the lines in the edge region was observed.