| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10666545 | Materials Letters | 2005 | 4 Pages |
Abstract
This paper reports the study of super-gravity effects on electroless copper coating on nickel substrate. The plating rates were obtained versus varying super-gravity accelerations and two super-gravity directions by thickness measurement of Cu coating. Composition and morphology of the coating were measured by XRD and SEM analysis. The use of super-gravity field during electroless copper plating can increase the plating rate and enlarge the size of Cu crystal grain. Coating surface vertical to super-gravity can obtain better coating than in position whose surface parallel to super-gravity.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Yingpeng Gong, Zhancheng Guo, Weichang Lu,